Departament
ELECTRÓNICA Y TECNOLOGÍA DE COMPUTADORES
Aportacions a congrés (2) Publicacions en què ha participat algun/a investigador/a
2024
-
Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop
Lecture Notes in Mechanical Engineering
-
Printed and chipless humidity sensor using NFC inspired technology.
IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024