Departamento
ELECTRÓNICA Y TECNOLOGÍA DE COMPUTADORES
Aportaciones congreso (2) Publicaciones en las que ha participado algún/a investigador/a
2024
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Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop
Lecture Notes in Mechanical Engineering
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Printed and chipless humidity sensor using NFC inspired technology.
IEEE Electron Devices Technology and Manufacturing Conference: Strengthening the Globalization in Semiconductors, EDTM 2024